Back-end semiconductor packaging operations rely on precise tracking of dies and chip trays as they move through dicing, pick-and-place, bonding, and testing processes. Any misidentification or loss of tracking can result in die mix-ups, yield loss, and process disruption.

A fixed mount code reader enables reliable reading of 1D and 2D codes on chip trays and carriers throughout back-end production flow. It ensures accurate identification of trays and their contents at every stage, supporting seamless material flow between processes. This improves production control, reduces handling errors, and enhances overall efficiency in semiconductor packaging operations.